Wiki

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
university:courses:electronics:electronics-lab-scr [07 Feb 2022 15:16] – [Activity: Silicon Controlled Rectifiers (SCR)] Doug Merceruniversity:courses:electronics:electronics-lab-scr [27 May 2022 21:00] (current) – [LATCH-UP] Doug Mercer
Line 158: Line 158:
  
 Latch-up is a potentially destructive situation in which a parasitic SCR is triggered, shorting the  Latch-up is a potentially destructive situation in which a parasitic SCR is triggered, shorting the 
-positive and negative supplies together. If current flow is not limited, electrical overstress will +positive and negative supplies together. If current flow is not limited, electrical over-stress will 
 occur. The classic case of latch-up occurs in CMOS output devices, in which the driver transistors and  occur. The classic case of latch-up occurs in CMOS output devices, in which the driver transistors and 
 wells form a four layer PNPN SCR structure when one of the two parasitic base-emitter junctions is  wells form a four layer PNPN SCR structure when one of the two parasitic base-emitter junctions is 
-momentarily forward biased during an overvoltage upset event. The SCR turns on and essentially causes a +momentarily forward biased during an over-voltage upset event. The SCR turns on and essentially causes a 
 short between the V<sub>DD</sub> power supply and ground. short between the V<sub>DD</sub> power supply and ground.
  
Line 175: Line 175:
 <WRAP centeralign> Figure 6 Cross-section of PMOS and NMOS devices, with parasitic transistors Q<sub>1</sub> and Q<sub>2</sub> </WRAP> <WRAP centeralign> Figure 6 Cross-section of PMOS and NMOS devices, with parasitic transistors Q<sub>1</sub> and Q<sub>2</sub> </WRAP>
  
-Proper design methods to reduce the possiblility of SCR formation include increasing the spacing between  +Proper design methods to reduce the possibility of SCR formation include increasing the spacing between  
-NMOS and PMOS devices and interposing highly doped regions bweteen and around Nwells and Pwells. Both of +NMOS and PMOS devices and interposing highly doped regions between and around Nwells and Pwells. Both of 
 these kinds of layout approaches attempt to lower the ß of either the vertical PNP or the lateral NPN  these kinds of layout approaches attempt to lower the ß of either the vertical PNP or the lateral NPN 
 parasitic bipolar transistors to less than 1. Some of these methods also tend to lower the resistance of  parasitic bipolar transistors to less than 1. Some of these methods also tend to lower the resistance of 
Line 188: Line 188:
 </WRAP> </WRAP>
  
-**For Further Reading:**+=====The Programmable UJT (PUT)=====
  
-http://en.wikipedia.org/wiki/Silicon-controlled_rectifier+The Programmable unijunction transistor or PUT is a close relative of other four layer devices in the thyristor familyIts has a four layered construction just like the SCR and has three terminals named anode(A), cathode(K) and gate(G) again like the thyristorsBackground and example circuits that use the PUT can be found in this [[:university:courses:alm1k:alm-lab-scr#programmable_ujt_put|ADALM1000 Lab Activity]].
  
-[[adi>static/imported-files/application_notes/AN-397.pdf| Electrically Induced Damage to Standard Linear Integrated Circuits]]+**For Further Reading:**
  
 +[[http://en.wikipedia.org/wiki/Silicon-controlled_rectifier|The Silicon Controlled Rectifier]]\\
 +[[adi>static/imported-files/application_notes/AN-397.pdf| Electrically Induced Damage to Standard Linear Integrated Circuits]]\\
 [[adi>library/analogDialogue/archives/35-05/latchup/latchup.pdf|Winning the Battle Against Latch-up in CMOS Analog Switches]] [[adi>library/analogDialogue/archives/35-05/latchup/latchup.pdf|Winning the Battle Against Latch-up in CMOS Analog Switches]]
  
university/courses/electronics/electronics-lab-scr.txt · Last modified: 27 May 2022 21:00 by Doug Mercer