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| resources:eval:user-guides:adrv9009-zu11eg:hardware [09 Dec 2019 18:12] – Brian OLoughlin | resources:eval:user-guides:adrv9009-zu11eg:hardware [09 Dec 2019 18:29] – Brian OLoughlin | ||
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| - | The 3D model is located here: | + | The RF-SOM |
| * {{: | * {{: | ||
| * {{: | * {{: | ||
| The Heat spreader plate 3D model is located here: | The Heat spreader plate 3D model is located here: | ||
| - | * {{: | + | * {{: |
| + | * {{: | ||
| Note: Thermal material being used is Panasonic EYG-T7070A10A. The Power Control sequencer shuts down when the PCB reaches 90C. | Note: Thermal material being used is Panasonic EYG-T7070A10A. The Power Control sequencer shuts down when the PCB reaches 90C. | ||
| </ | </ | ||
resources/eval/user-guides/adrv9009-zu11eg/hardware.txt · Last modified: 24 May 2022 19:55 by Brian OLoughlin