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resources:eval:user-guides:adrv9009-zu11eg:hardware [24 Oct 2019 17:47] – Brian OLoughlin | resources:eval:user-guides:adrv9009-zu11eg:hardware [09 Dec 2019 18:24] – Brian OLoughlin | ||
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- | ==== Hardware | + | ==== Mechanical |
<WRAP round download> | <WRAP round download> | ||
- | Power sequence: | ||
- | * {{: | ||
- | |||
The X-Y Footprint is located here: | The X-Y Footprint is located here: | ||
* {{: | * {{: | ||
- | The 3D model is located here: | + | The RF-SOM |
* {{: | * {{: | ||
* {{: | * {{: | ||
The Heat spreader plate 3D model is located here: | The Heat spreader plate 3D model is located here: | ||
- | * {{: | + | * {{: |
+ | * {{: | ||
Note: Thermal material being used is Panasonic EYG-T7070A10A. The Power Control sequencer shuts down when the PCB reaches 90C. | Note: Thermal material being used is Panasonic EYG-T7070A10A. The Power Control sequencer shuts down when the PCB reaches 90C. | ||
+ | </ | ||
+ | ==== Electrical Reference Material ==== | ||
+ | <WRAP round download> | ||
The FMC connector pinouts are located here: | The FMC connector pinouts are located here: | ||
* {{: | * {{: | ||
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The System Clocking Tree Diagram is located here: | The System Clocking Tree Diagram is located here: | ||
* {{: | * {{: | ||
+ | </ | ||
+ | ==== Power Reference Material ==== | ||
+ | <WRAP round download> | ||
The System Power Map Diagram is located here: | The System Power Map Diagram is located here: | ||
* {{: | * {{: | ||
+ | |||
+ | Power sequence: | ||
+ | * {{: | ||
</ | </ | ||
- | ===== ADRV9009-ZU11EG Schematics | + | ==== ADRV9009-ZU11EG Schematics, BOM & Errata |
The versions below are at X-GRADE Revision. | The versions below are at X-GRADE Revision. | ||
<WRAP round download> | <WRAP round download> |