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This version is outdated by a newer approved version.DiffThis version (09 Mar 2023 01:49) was approved by Joyce Velasco.The Previously approved version (19 May 2021 16:03) is available.Diff

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AD-FMCOMMS4-EBZ Hardware

Schematic, PCB Layout, Bill of Materials

Note that the Baluns on the Rev C board (T101-T104) are either:

  • Johanson Technology's 2450BL15B050E 2.45 GHz Balun. This balun is rated for a operating frequency of 2400~2500 MHz and is connected to RXB Input and TXB Output. If you want to evaluate the part outside of this frequency range, use the other SMA.
  • Mini Circuits TCM1-63AX+. They are rated for an operating frequency between 70 MHz and 6 GHz, and are connected to the RXA Input and TXB Output.

AD-FMCOMMS4-EBZ Rev. C Design & Integration Files

  • Schematic
  • PCB Layout
  • Bill of Materials
  • Allegro Project

Note that the Baluns on the Rev B board (T101-T104) are either:

  • Johanson Technology's 2450BL15B050E 2.45 GHz Balun. This balun is rated for a operating frequency of 2400~2500 MHz. If you want to evaluate the part outside of this frequency range, an alternative balun should be installed. The test results were taken using the Johanson Technology's 2450BL15B050E balun.
  • Mini Circuits TCM1-63AX+. They are rated for an operating frequency between 10 MHz and 6 GHz.
  • The Epson crystal used on this board, has the generic part number “TSX-3225 40.0000MHZ” - however, the generic part number does not have the specifications needed to meet the AD9361 datasheet specs. ADI has worked with Epson to provide a tighter tolerance part, which can be ordered as the “OUTD-2B-0166” or “X1E000021036701” (either part number will work, depending on which system your Epson contact/distributor has) which meets the requirements that the AD9361 demands.

I/O Voltage

The AD-FMComms4 (AD9364) assumes a VDD_INTERFACE voltage between 1.71V and 2.625V (1.8 to 2.5 +/- 5%), so on your FPGA carrier board, you should ensure that VADJ is between these levels. Setting things to 3.3V will damage the part.

Picture and Main components

Layers

The AD-FMCOMMS4-EBZ is a 10 layer board.

Design Cross Section

Subclass Name Type Material Thickness (MIL) Conductivity (mho/cm) Dielectric Constant Loss Tangent Shield Width (MIL)
SURFACE AIR 0 1 0
TOP CONDUCTOR COPPER 2.025 595900 1 0 8.00
DIELECTRIC FR-4 8 0 3.38 0.035
L2_GND PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC BT_EPOXY 3 0 4.10 0.02
L3_PWR PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC FR-4 3 0 4.10 0.035
L4_GND PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC BT_EPOXY 4.60 0 4.10 0.02
L5_SIG CONDUCTOR COPPER 1.35 595900 1 0.035 3.80
DIELECTRIC FR-4 8 0 4.10 0.035
L6_SIG CONDUCTOR COPPER 1.35 595900 1 0.035 3.80
DIELECTRIC BT_EPOXY 4.60 0 4.10 0.02
L7_GND PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC FR-4 3 0 4.10 0.035
L8_PWR PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC BT_EPOXY 3 0 4.10 0.02
L9_GND PLANE COPPER 1.35 595900 1 0.035 Y
DIELECTRIC FR-4 8 0 3.38 0.035
BOTTOM CONDUCTOR COPPER 2.025 595900 1 0 8.00
SURFACE AIR 0 1 0

resources/eval/user-guides/ad-fmcomms4-ebz/hardware.1678322953.txt.gz · Last modified: 09 Mar 2023 01:49 by Joyce Velasco