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resources:eval:user-guides:adrv9009-zu11eg:hardware [20 Sep 2021 11:12] – [ADRV9009-ZU11EG RF-SOM Hardware Overview] Claudia Gogaresources:eval:user-guides:adrv9009-zu11eg:hardware [17 May 2022 15:27] – Brian OLoughlin
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 {{:resources:eval:user-guides:adrv9009_zu11eg:rfsom_blk_dig.png|}} {{:resources:eval:user-guides:adrv9009_zu11eg:rfsom_blk_dig.png|}}
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-{{ :resources:eval:user-guides:adrv9009-zu11eg:adrv9009_zu11eg_connector_pinout.xlsx |}}+
 ==== Connector Interface ==== ==== Connector Interface ====
 The interface of the ADRV9009-ZU11EG consists of two SAMTEC SEARAY™ 400-pin female connectors P1 and P2. Following signals are present: The interface of the ADRV9009-ZU11EG consists of two SAMTEC SEARAY™ 400-pin female connectors P1 and P2. Following signals are present:
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 === Programmable Logic GPIOs === === Programmable Logic GPIOs ===
 == High Performance GPIOs == == High Performance GPIOs ==
-Programmable logic high performance banks 65, 67 and 68 are fully accessible in connector P2. Prior of using these signals the bank supply VCCO must be provided, with a voltage between 0.95V and 1.9V. A reference voltage must be applied as well, if the IO standard requires one. To use the internal VREF voltage a 500 or 1K resistor needs to be connected from VREF pin to ground.+Programmable logic high performance banks 65, 67 and 68 are fully accessible in connector P2. Prior of using these signals the bank supply VCCO must be provided, with a voltage between 0.95V and 1.9V. A reference voltage must be applied as well, if the IO standard requires one. To use the internal VREF voltage a 500 or 1KOhm resistor needs to be connected from VREF pin to ground.
 == High Density GPIOs  == == High Density GPIOs  ==
 Programmable logic High density bank 89 is partially available in connector P2. Connect a voltage between 1.14V and 3.4V to the bank supply voltage VCCO_89. Programmable logic High density bank 89 is partially available in connector P2. Connect a voltage between 1.14V and 3.4V to the bank supply voltage VCCO_89.
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 <note important>The ADRV9009-ZU11EG RF-SOM requires active cooling. It includes overtemperature protection, which interrupts power to the RF-SOM when board temperature reaches 90degC. Without a fan the RF-SOM will turn off in a few minutes under normal operating conditions (25degC ambient, Linux machine running). </note> <note important>The ADRV9009-ZU11EG RF-SOM requires active cooling. It includes overtemperature protection, which interrupts power to the RF-SOM when board temperature reaches 90degC. Without a fan the RF-SOM will turn off in a few minutes under normal operating conditions (25degC ambient, Linux machine running). </note>
  
-Included in the ADRV9009-ZU11EG RF-SOM package is a custom designed heat spreader plate, that acts as a mounting base for an active cooler. The Panasonic EYG-T7070A10A thermal pad, which is included in the package should be used as contact area between Xilinx Ultrascale+ package and heat spreader plate.+The ADRV9009-ZU11EG RF-SOM comes equipped with a custom designed heat spreader plate, that acts as a mounting base for an active cooler. Panasonic EYG-T7070A10A thermal pad is used between RF-SOM and plate.
  
  
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-The [[adi>ADRV2CRR-FMC]] kit includes a heatsink with active cooler for the ADRV9009-ZU11EG RF-SOM, and Würth Elektronik 39410 EMI gasket sheet, that acts both as thermal transfer material between heat plate and heatsink and RF Shield/Absorber. +The [[adi>ADRV2CRR-FMC]] kit includes a heatsink with fan for the ADRV9009-ZU11EG RF-SOM, and Würth Elektronik 39410 EMI gasket sheet, that acts both as thermal transfer material between plate and heatsink, and RF Shield/Absorber. 
  
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 ==== ADRV9009-ZU11EG Schematics, BOM & Errata ==== ==== ADRV9009-ZU11EG Schematics, BOM & Errata ====
-Rev C is the latest and is in mass production.+Rev C is the latest available version.
 <WRAP round download> <WRAP round download>
     * {{:resources:eval:user-guides:adrv9009_zu11eg:02-048949-01-c.pdf|Rev C Schematics}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:02-048949-01-c.pdf|Rev C Schematics}}
     * {{:resources:eval:user-guides:adrv9009_zu11eg:05-048949-01-c.zip|Rev C BOM}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:05-048949-01-c.zip|Rev C BOM}}
     * {{:resources:eval:user-guides:adrv9009_zu11eg:revb_to_revc_errata.xlsx|Rev B to Rev C Errata}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:revb_to_revc_errata.xlsx|Rev B to Rev C Errata}}
 +    * {{ :resources:eval:user-guides:adrv9009-zu11eg:letter_of_volatility_adrv9009-zu11eg.pdf|Rev C Letter of Volatility}}
 </WRAP> </WRAP>
  
resources/eval/user-guides/adrv9009-zu11eg/hardware.txt · Last modified: 24 May 2022 19:55 by Brian OLoughlin

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