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This version (26 Jun 2014 16:43) was approved by Jason Coutermarsh, Connor Kang, Keiichi Okuji.The Previously approved version (06 Feb 2014 23:24) is available.Diff

DPG3

The DPG3, or Data Pattern Generator 3, is a device designed to support the evaluation of Analog Devices' High-Speed Digital-to-Analog Converters (DAC). The device is connected to a PC over USB, and allows a user to download a data vector into the DPG3, which is then played out to an attached DAC evaluation board at full speed.

Please note: Analog Devices' pattern generators and high-speed DAC evaluation boards are designed and sold solely to support an efficient and thorough means by which to evaluate Analog Devices high speed DACs in a lab environment for a wide range of end applications. Any application or use of the pattern generators and/or high-speed DAC evaluation boards, other than specified above, will not be supported.

This page describes the hardware of DPG3. The device can be driven from many different software applications. For more information on the software, please see the High-Speed DAC Software Suite documentation.

For information on the DPG2, the predecessor to the DPG3, please see the DPG2 page.

Ordering Code

The part number for the DPG3 is AD-DPG3.

To order an DPG3, please visit the DPG3 Ordering Page

Hardware Specifications

Please note that not all hardware options and specifications are supported with any particular evaluation board or software package. Specifications are subject to change without notice.

  • Converter Interfaces
    • CMOS Interface
      • 32-bits (shared with the P lines of the LVDS bus)
      • Up to 250Mbps per bit(SDR)
      • Same connector and pinout as DPG2
    • LVDS Interface
      • 32-bits (P lines shared with CMOS interface)
      • Up to 1.6Gbps per bit (800MHz DDR)
      • Same connector and pinout as DPG2
    • High-Speed Serial Interface (For JESD204 Converters)
      • 16 Tx lanes
      • Up to 8.5Gbps per lane
  • Memory
    • Dual DDR3 SO-DIMM
    • Maximum pattern length of 134M samples (limited to 30M samples in most 3'rd party software)
  • PC Interface
    • USB 2.0 “B” connector
  • Clocking
    • On-connector clock input for all interfaces
    • Optional external clock input via front-panel SMA jack for CMOS and LVDS interfaces
  • Trigger
    • SMA jack for trigger input or output
  • Specified for operation at 25ºC only

Some PCs with USB 3.0 SuperSpeed ports have been unable to communicate reliably with the DPG3. On these PCs, the standard USB 2.0 ports (without the logo) should be used with the DPG3.

Output Data

The vector length must be at least 64 points per channel, and the vector length must be divisible by 64 for proper operation.

Clocking

The clocking system varies between the traditional CMOS/LVDS interfaces and the newer high-speed serial interface. In all cases, the DPG needs to be provided with a clock. It cannot generate a data clock internally.

CMOS/LVDS

Most evaluation boards will supply a clock to the DPG over the CMOS/LVDS connector. In all cases, this clock is LVDS, even if the rest of the interface is CMOS. A clock will be provided with the data that is synchronous to the data (source synchronous), which will match the format of the data.

Alternatively, a clock can be provided externally via the SMA jack on the front of the unit. In this case, the clock's amplitude must be +4dBm. This method is not recommended for general use. To enable the external clock operation, click the Advanced/Debug button in DPGDownloader, and select Front panel SMA jack as the Clock Source in the Clock section.

High-Speed Serial

The high-speed serial transceivers inside the DPG3 require a reference clock in order to be able to lock on to the embedded clock inside the serial data stream. This clock must be provided over the connector to the evaluation board.

External Trigger

The SMA jack on the front of the unit for the trigger can be used either as an input or as an output trigger. To enable the trigger, click Advanced/Debug in DPGDownloader, and check the Enable Trigger box in the Trigger section.

Input Trigger

When set as an input, the unit will start playback when the trigger is asserted (raised from low to high).

The input high threshold is 2.0V, and the input low threshold is 0.8V, allowing it to be directly interfaced with 3.3V logic signals.

Output Trigger

When set as an output, the trigger will pulse when the playback is running at the beginning of the vector. Therefore, it will pulse every time the vector is looped when in Loop mode, or only once if the unit is in Count mode.

Connector Pinouts

The DGP3 has two separate connector systems for interfacing with evaluation boards. One, for CMOS and LVDS interface DACs, is backwards compatible with the DPG2. The second connector is new to the DPG3, and supports high-speed serial, power, and communications.

CMOS/LVDS Pinout

The CMOS/LVDS connection on DPG2 and DPG3 uses two AMP/Tyco 1469169-1 connectors, placed side-by-side, with 139.2mil spacing between the centers of the innermost pins on both connectors. The mating connector on the evaluation board side is two AMP/Tyco 1469028-1. Note that both connectors are always required.

Left Side Connector

The left connector when looking at the connection on the DPG from the evaluation board side (J17 on the DPG2, J8 on the DPG3)

Pin Name Description
A1 CLK_DCOA_P Data Clock Out from the DUT, into the DPG. Positive side of differential signal.(required)
B1 CLK_DCOA_N Data Clock Out from the DUT, into the DPG. Negative side of differential signal.(required)
A2 CLK_TXI_O_P Data Clock output from DPG, synchronous with “I” data. Positive side of differential signal.
B2 CLK_TXI_O_N Data Clock output from DPG, synchronous with “I” data. Negative side of differential signal.
A3 TXI_DATA_P15 “I” channel data bit 15.
B3 TXI_DATA_N15 “I” channel data bit 15, negative side in LVDS mode. Not used in CMOS mode.
A4 TXI_DATA_P14 “I” channel data bit 14.
B4 TXI_DATA_N14 “I” channel data bit 14, negative side in LVDS mode. Not used in CMOS mode.
A5 TXI_DATA_P13 “I” channel data bit 13.
B5 TXI_DATA_N13 “I” channel data bit 13, negative side in LVDS mode. Not used in CMOS mode.
A6 TXI_DATA_P12 “I” channel data bit 12.
B6 TXI_DATA_N12 “I” channel data bit 12, negative side in LVDS mode. Not used in CMOS mode.
A7 TXI_DATA_P11 “I” channel data bit 11.
B7 TXI_DATA_N11 “I” channel data bit 11, negative side in LVDS mode. Not used in CMOS mode.
A8 TXI_DATA_P10 “I” channel data bit 10.
B8 TXI_DATA_N10 “I” channel data bit 10, negative side in LVDS mode. Not used in CMOS mode.
A9 TXI_DATA_P9 “I” channel data bit 9.
B9 TXI_DATA_N9 “I” channel data bit 9, negative side in LVDS mode. Not used in CMOS mode.
A10 TXI_DATA_P8 “I” channel data bit 8.
B10 TXI_DATA_N8 “I” channel data bit 8, negative side in LVDS mode. Not used in CMOS mode.
BG1 GROUND Digital Ground
BG2 GROUND Digital Ground
BG3 GROUND Digital Ground
BG4 GROUND Digital Ground
BG5 GROUND Digital Ground
BG6 GROUND Digital Ground
BG7 GROUND Digital Ground
BG8 GROUND Digital Ground
BG9 GROUND Digital Ground
BG10 GROUND Digital Ground
C1 N/C No Connect (DPG2) / “Q” channel bi-directional, low-speed LVDS 1, positive side (DPG3)
D1 N/C No Connect (DPG2) / “Q” channel bi-directional, low-speed LVDS 1, negative side (DPG3)
C2 N/C No Connect (DPG2) / “Q” channel bi-directional, low-speed LVDS 0, positive side (DPG3)
D2 N/C No Connect (DPG2) / “Q” channel bi-directional, low-speed LVDS 0, negative side (DPG3)
C3 TXQ_DATA_P15 “Q” channel data bit 15.
D3 TXQ_DATA_N15 “Q” channel data bit 15, negative side in LVDS mode. Not used in CMOS mode.
C4 TXQ_DATA_P14 “Q” channel data bit 14.
D4 TXQ_DATA_N14 “Q” channel data bit 14, negative side in LVDS mode. Not used in CMOS mode.
C5 TXQ_DATA_P13 “Q” channel data bit 13.
D5 TXQ_DATA_N13 “Q” channel data bit 13, negative side in LVDS mode. Not used in CMOS mode.
C6 TXQ_DATA_P12 “Q” channel data bit 12.
D6 TXQ_DATA_N12 “Q” channel data bit 12, negative side in LVDS mode. Not used in CMOS mode.
C7 TXQ_DATA_P11 “Q” channel data bit 11.
D7 TXQ_DATA_N11 “Q” channel data bit 11, negative side in LVDS mode. Not used in CMOS mode.
C8 TXQ_DATA_P10 “Q” channel data bit 10.
D8 TXQ_DATA_N10 “Q” channel data bit 10, negative side in LVDS mode. Not used in CMOS mode.
C9 TXQ_DATA_P9 “Q” channel data bit 9.
D9 TXQ_DATA_N9 “Q” channel data bit 9, negative side in LVDS mode. Not used in CMOS mode.
C10 TXQ_DATA_P8 “Q” channel data bit 8.
D10 TXQ_DATA_N8 “Q” channel data bit 8, negative side in LVDS mode. Not used in CMOS mode.
DG1 GROUND Digital Ground
DG2 GROUND Digital Ground
DG3 GROUND Digital Ground
DG4 GROUND Digital Ground
DG5 GROUND Digital Ground
DG6 GROUND Digital Ground
DG7 GROUND Digital Ground
DG8 GROUND Digital Ground
DG9 GROUND Digital Ground
DG10 GROUND Digital Ground

Right Side Connector

The right connector when looking at the connection on the DPG from the evaluation board side (J18 on the DPG2, J10 on the DPG3)

Pin Name Description
A1 TXI_DATA_P7 “I” channel data bit 7.
B1 TXI_DATA_N7 “I” channel data bit 7, negative side in LVDS mode. Not used in CMOS mode.
A2 TXI_DATA_P6 “I” channel data bit 6.
B2 TXI_DATA_N6 “I” channel data bit 6, negative side in LVDS mode. Not used in CMOS mode.
A3 TXI_DATA_P5 “I” channel data bit 5.
B3 TXI_DATA_N5 “I” channel data bit 5, negative side in LVDS mode. Not used in CMOS mode.
A4 TXI_DATA_P4 “I” channel data bit 4.
B4 TXI_DATA_N4 “I” channel data bit 4, negative side in LVDS mode. Not used in CMOS mode.
A5 TXI_DATA_P3 “I” channel data bit 3.
B5 TXI_DATA_N3 “I” channel data bit 3, negative side in LVDS mode. Not used in CMOS mode.
A6 TXI_DATA_P2 “I” channel data bit 2.
B6 TXI_DATA_N2 “I” channel data bit 2, negative side in LVDS mode. Not used in CMOS mode.
A7 TXI_DATA_P1 “I” channel data bit 1.
B7 TXI_DATA_N1 “I” channel data bit 1, negative side in LVDS mode. Not used in CMOS mode.
A8 TXI_DATA_P0 “I” channel data bit 0.
B8 TXI_DATA_N0 “I” channel data bit 0, negative side in LVDS mode. Not used in CMOS mode.
A9 N/C No Connect (DPG2) / “I” channel bi-directional, low-speed LVDS 1, positive side (DPG3)
B9 N/C No Connect (DPG2) / “I” channel bi-directional, low-speed LVDS 1, negativeside (DPG3)
A10 N/C No Connect (DPG2) / “I” channel bi-directional, low-speed LVDS 0, positive side (DPG3)
B10 N/C No Connect (DPG2) / “I” channel bi-directional, low-speed LVDS 0, negative side (DPG3)
BG1 GROUND Digital Ground
BG2 GROUND Digital Ground
BG3 GROUND Digital Ground
BG4 GROUND Digital Ground
BG5 GROUND Digital Ground
BG6 GROUND Digital Ground
BG7 GROUND Digital Ground
BG8 GROUND Digital Ground
BG9 GROUND Digital Ground
BG10 GROUND Digital Ground
C1 TXQ_DATA_P7 “Q” channel data bit 7.
D1 TXQ_DATA_N7 “Q” channel data bit 7, negative side in LVDS mode. Not used in CMOS mode.
C2 TXQ_DATA_P6 “Q” channel data bit 6.
D2 TXQ_DATA_N6 “Q” channel data bit 6, negative side in LVDS mode. Not used in CMOS mode.
C3 TXQ_DATA_P5 “Q” channel data bit 5.
D3 TXQ_DATA_N5 “Q” channel data bit 5, negative side in LVDS mode. Not used in CMOS mode.
C4 TXQ_DATA_P4 “Q” channel data bit 4.
D4 TXQ_DATA_N4 “Q” channel data bit 4, negative side in LVDS mode. Not used in CMOS mode.
C5 TXQ_DATA_P3 “Q” channel data bit 3.
D5 TXQ_DATA_N3 “Q” channel data bit 3, negative side in LVDS mode. Not used in CMOS mode.
C6 TXQ_DATA_P2 “Q” channel data bit 2.
D6 TXQ_DATA_N2 “Q” channel data bit 2, negative side in LVDS mode. Not used in CMOS mode.
C7 TXQ_DATA_P1 “Q” channel data bit 1.
D7 TXQ_DATA_N1 “Q” channel data bit 1, negative side in LVDS mode. Not used in CMOS mode.
C8 TXQ_DATA_P0 “Q” channel data bit 0.
D8 TXQ_DATA_N0 “Q” channel data bit 0, negative side in LVDS mode. Not used in CMOS mode.
C9 CLK_TXQ_O_P Data Clock output from DPG, synchronous with “Q” data. Positive side of differential signal.
D9 CLK_TXQ_O_N Data Clock output from DPG, synchronous with “Q” data. Negative side of differential signal.
C10 CLK_DCOB_P Data Clock Out from the DUT, into the DPG. Positive side of differential signal. Must be phase and frequency locked with CLK_DCOA. (required for DPG2)
D10 CLK_DCOB_N Data Clock Out from the DUT, into the DPG. Negative side of differential signal. Must be phase and frequency locked with CLK_DCOA. (required for DPG2)
DG1 GROUND Digital Ground
DG2 GROUND Digital Ground
DG3 GROUND Digital Ground
DG4 GROUND Digital Ground
DG5 GROUND Digital Ground
DG6 GROUND Digital Ground
DG7 GROUND Digital Ground
DG8 GROUND Digital Ground
DG9 GROUND Digital Ground
DG10 GROUND Digital Ground

High-Speed Serial Connector

The second connector system on the DPG3 uses an FCi AirMax connector, part number 10057041-101LF. The mating connector used on the evaluation board is part number 10037324-101LF.

Pin Name Description
A1 SCL I2C Clock for communicating with evaluation board
B1 SDA I2C Data for communicating with evaluation board
C1 GROUND Digital Ground
D1 ALIGN_TX_N SYSREF clock input for Tx
E1 ALIGN_TX_P SYSREF clock input for Tx
F1 GROUND Digital Ground
G1 FRAME_TX_N Device clock input for Tx
H1 FRAME_TX_P Device clock input for Tx
I1 GROUND Digital Ground
J1 TXSYNC2_N SYNC input for Tx (secondary)
K1 TXSYNC2_P SYNC input for Tx (secondary)
L1 GROUND Digital Ground
M1 TXSYNC1_N SYNC input for Tx
N1 TXSYNC1_P SYNC input for Tx
O1 GROUND Digital Ground
A2 GPIO3 General-Purpose I/O 3
B2 PWR_SENSE Pulled up to 3.3V on the evaluation board to allow the DPG3 to detect when a board is powered
C2 BRD_DETECT Tied to ground on the evaluation board to allow the DPG3 to detect a connected board
D2 GROUND Digital Ground
E2 RX13_N Receive SERDES Lane (into FPGA) 13*
F2 RX13_P Receive SERDES Lane (into FPGA) 13*
G2 GROUND Digital Ground
H2 TX9_N Transmit SERDES Lane (from FPGA) 9
I2 TX9_P Transmit SERDES Lane (from FPGA) 9
J2 GROUND Digital Ground
K2 RX5_N Receive SERDES Lane (into FPGA) 5*
L2 RX5_P Receive SERDES Lane (into FPGA) 5*
M2 GROUND Digital Ground
N2 TX1_N Transmit SERDES Lane (from FPGA) 1
O2 TX1_P Transmit SERDES Lane (from FPGA) 1
A3 GROUND Power Ground
B3 +6V0 +6V Power
C3 GROUND Digital Ground
D3 RX14_N Receive SERDES Lane (into FPGA) 14*
E3 RX14_P Receive SERDES Lane (into FPGA) 14*
F3 GROUND Digital Ground
G3 TX10_N Transmit SERDES Lane (from FPGA) 10
H3 TX10_P Transmit SERDES Lane (from FPGA) 10
I3 GROUND Digital Ground
J3 RX6_N Receive SERDES Lane (into FPGA) 6*
K3 RX6_P Receive SERDES Lane (into FPGA) 6*
L3 GROUND Digital Ground
M3 TX2_N Transmit SERDES Lane (from FPGA) 2
N3 TX2_P Transmit SERDES Lane (from FPGA) 2
O3 GROUND Digital Ground
A4 +6V0 +6V Power
B4 GROUND Power Ground
C4 +6V0 +6V Power
D4 GROUND Digital Ground
E4 RX15_N Receive SERDES Lane (into FPGA) 15*
F4 RX15_P Receive SERDES Lane (into FPGA) 15*
G4 GROUND Digital Ground
H4 TX11_N Transmit SERDES Lane (from FPGA) 11
I4 TX11_P Transmit SERDES Lane (from FPGA) 11
J4 GROUND Digital Ground
K4 RX7_N Receive SERDES Lane (into FPGA) 7*
L4 RX7_P Receive SERDES Lane (into FPGA) 7*
M4 GROUND Digital Ground
N4 TX3_N Transmit SERDES Lane (from FPGA) 3
O4 TX3_P Transmit SERDES Lane (from FPGA) 3
A5 GROUND Power Ground
B5 +6V0 +6V Power
C5 GROUND Digital Ground
D5 RX16_N Receive SERDES Lane (into FPGA) 16*
E5 RX16_P Receive SERDES Lane (into FPGA) 16*
F5 GROUND Digital Ground
G5 TX12_N Transmit SERDES Lane (from FPGA) 12
H5 TX12_P Transmit SERDES Lane (from FPGA) 12
I5 GROUND Digital Ground
J5 RX8_N Receive SERDES Lane (into FPGA) 8*
K5 RX8_P Receive SERDES Lane (into FPGA) 8*
L5 GROUND Digital Ground
M5 TX4_N Transmit SERDES Lane (from FPGA) 4
N5 TX4_P Transmit SERDES Lane (from FPGA) 4
O5 GROUND Digital Ground
A6 +6V0 +6V Power
B6 GROUND Power Ground
C6 +6V0 +6V Power
D6 GROUND Digital Ground
E6 TX13_N Transmit SERDES Lane (from FPGA) 13
F6 TX13_P Transmit SERDES Lane (from FPGA) 13
G6 GROUND Digital Ground
H6 RX9_N Receive SERDES Lane (into FPGA) 9*
I6 RX9_P Receive SERDES Lane (into FPGA) 9*
J6 GROUND Digital Ground
K6 TX5_N Transmit SERDES Lane (from FPGA) 5
L6 TX5_P Transmit SERDES Lane (from FPGA) 5
M6 GROUND Digital Ground
N6 RX1_N Receive SERDES Lane (into FPGA) 1*
O6 RX1_P Receive SERDES Lane (into FPGA) 1*
A7 CS3 SPI Chip Select 3†
B7 CS6 SPI Chip Select 6†
C7 GROUND Digital Ground
D7 TX14_N Transmit SERDES Lane (from FPGA) 14
E7 TX14_P Transmit SERDES Lane (from FPGA) 14
F7 GROUND Digital Ground
G7 RX10_N Receive SERDES Lane (into FPGA) 10*
H7 RX10_P Receive SERDES Lane (into FPGA) 10*
I7 GROUND Digital Ground
J7 TX6_N Transmit SERDES Lane (from FPGA) 6
K7 TX6_P Transmit SERDES Lane (from FPGA) 6
L7 GROUND Digital Ground
M7 RX2_N Receive SERDES Lane (into FPGA) 2*
N7 RX2_P Receive SERDES Lane (into FPGA) 2*
O7 GROUND Digital Ground
A8 CS2 SPI Chip Select 2†
B8 CS5 SPI Chip Select 5†
C8 CS7 SPI Chip Select 7†
D8 GROUND Digital Ground
E8 TX15_N Transmit SERDES Lane (from FPGA) 15
F8 TX15_P Transmit SERDES Lane (from FPGA) 15
G8 GROUND Digital Ground
H8 RX11_N Receive SERDES Lane (into FPGA) 11*
I8 RX11_P Receive SERDES Lane (into FPGA) 11*
J8 GROUND Digital Ground
K8 TX7_N Transmit SERDES Lane (from FPGA) 7
L8 TX7_P Transmit SERDES Lane (from FPGA) 7
M8 GROUND Digital Ground
N8 RX3_N Receive SERDES Lane (into FPGA) 3*
O8 RX3_P Receive SERDES Lane (into FPGA) 3*
A9 CS1 SPI Chip Select 1†
B9 CS4 SPI Chip Select 4†
C9 GROUND Digital Ground
D9 TX16_N Transmit SERDES Lane (from FPGA) 16
E9 TX16_P Transmit SERDES Lane (from FPGA) 16
F9 GROUND Digital Ground
G9 RX12_N Receive SERDES Lane (into FPGA) 12*
H9 RX12_P Receive SERDES Lane (into FPGA) 12*
I9 GROUND Digital Ground
J9 TX8_N Transmit SERDES Lane (from FPGA) 8
K9 TX8_P Transmit SERDES Lane (from FPGA) 8
L9 GROUND Digital Ground
M9 RX4_N Receive SERDES Lane (into FPGA) 4*
N9 RX4_P Receive SERDES Lane (into FPGA) 4*
O9 GROUND Digital Ground
A10 MISO SPI Master-In, Slave-Out Data†
B10 MOSI SPI Master-Out, Slave-In Data†
C10 SCLK SPI Clock†
D10 GROUND Digital Ground
E10 ALIGN_RX_N SYSREF clock input for Rx*
F10 ALIGN_RX_P SYSREF clock input for Rx*
G10 GROUND Digital Ground
H10 FRAME_RX_N Device clock input for Rx*
I10 FRAME_RX_P Device clock input for Rx*
J10 GROUND Digital Ground
K10 RXSYNC2_N SYNC input for Rx (secondary)*
L10 RXSYNC2_P SYNC input for Rx (secondary)*
M10 GROUND Digital Ground
N10 RXSYNC1_N SYNC input for Rx*
O10 RXSYNC1_P SYNC input for Rx*

* The RX SERDES lines are not enabled, and can not be used with JESD204 ADCs

† The SPI lines are not enabled. Communication with parts on the evaluation board is performed over the I2C link, and converted into SPI on the evaluation board

Firmware Update

The firmware of the DPG3 can be updated when new features or fixes are available. To update the firmware, click the Advanced/Debug button in DPGDownloader. Click the Update button in the Firmware section, and select the new firmware file. Do not interrupt the firmware update process. The unit may become inoperable if the update process is interrupted.

Legacy CMOS Evaluation Boards

Some legacy evaluation boards for DACs with a CMOS data interface use a ribbon cable to connect to a pattern generator, instead of connecting directly. To use these boards on a DPG3, an adapter board is required. Please contact DPG Support to request this adapter board.

Support

Please contact DPG Support with any additional questions regarding the DPG or DAC Software Suite.

resources/eval/dpg/dpg3.txt · Last modified: 26 Jun 2014 14:42 by Jason Coutermarsh