This section reports the EVM results for ADRV9361-Z7035 SDR 2×2 SOM. The general test setup is shown below. In this test, the block labeled “ADI Hardware System” represents the AD9361 on the SOM; the FPGA/SoC is the Zynq Z-7035 SoC on the SOM.
IIO System Object
All EVM measurements were under ~2.5%. This works out to about -32dB for the accumulation of RX and TX.
The AD9361 datasheet specs are ~ −37.782 dB for TX and −37.462 dB for RX (or about 1.4% each). It is an RMS sum, so we would expect about 1.86% (-34.6dB) based on the datasheet.
The datasheet uses narrowband baluns, and derives some gain from this. Since this test is using the wideband baluns on ADRV9361−Z7035 SDR 2×2, that gain is not seen. Therefore we consider the SOM to perform close enough to the AD9361 datasheet, with a difference of 0.6%.
Information regarding environmental and mechanical testing is listed here. Emissions, Sinusoidal vibration, random vibration, shock, temperature etc. The ADRV9x63x RF SOM family is tested against various military (https://mil-std.org) and Information Technology Standards (NIST) using external vendors with the appropriate equipment. All details and results of such are maintained in the test reports below.
The report listed above SOM2 Environmental Test Report also contains the results of MIL-STD-810G testing.
The ADRV9361-Z7035 SDR 2×2 is rated for operation in the industrial temperature range (-40 to 85°C). Please take care to respect the individual device maximum die temperatures over your operating range with your specific design running on the SOM.
All devices on the SOM are rated for this temperature range, with the exception of the Micro SD card cage, which is rated for operation from -25°C to +85°C; with storage over the full range listed in the table. The SOM has been validated to work reliably over the full industrial temp range.
Both the Zynq SoC and the AD9361 have the ability to measure and report their internal die temperature using their built-in data converters. These can be used to monitor the real-time temperature of these devices and, when necessary, start a fan wired to the carrier. In addition, for further heat dissipation, a heat sink may be attached directly to the package of the Zynq SoC on the SOM itself.
Selecting heat sinks for Xilinx All-Programmable FPGAs, 3G ICs, and SoCs depends upon many variables including chip size, device utilization, the ambient environment, and other criteria. Avnet and CTS® have created technical aids to ease this process of heat sink identification.
ADRV9361-Z7035 SDR 2×2 uses the Zynq XC7Z035-2LI device in the FBG676 package. The package outline measures 27 x 27 mm. See Xilinx UG865 for information on package size, thermal resistance, and recommendations for safely attaching heat sinks.