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resources:eval:user-guides:adrv9009-zu11eg:hardware [20 Sep 2021 09:48] – [ADRV9009-ZU11EG RF-SOM Hardware Overview] Claudia Gogaresources:eval:user-guides:adrv9009-zu11eg:hardware [24 May 2022 19:55] (current) – Brian OLoughlin
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-{{:resources:eval:user-guides:adrv9009-zu11eg:rf-som_heatsink.jpg?530|}} +{{:resources:eval:user-guides:adrv9009-zu11eg:rf-som_heatplate.jpg?500|}} 
-The ADRV9009-ZU11EG RF-SOM package includes: + 
-  * ADRV9009-ZU11EG board + 
-  * heat spreader plate +The **ADRV9009-ZU11EG RF-SOM** package includes: 
-  * +  * ADRV9009-ZU11EG board with heat spreader plate mounted on top 
 {{:resources:eval:user-guides:adrv9009_zu11eg:adrv9009_zu11eg_rfsom.png|}} {{:resources:eval:user-guides:adrv9009_zu11eg:adrv9009_zu11eg_rfsom.png|}}
 ---- ----
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 {{:resources:eval:user-guides:adrv9009_zu11eg:rfsom_blk_dig.png|}} {{:resources:eval:user-guides:adrv9009_zu11eg:rfsom_blk_dig.png|}}
 ---- ----
 +
 ==== Connector Interface ==== ==== Connector Interface ====
 The interface of the ADRV9009-ZU11EG consists of two SAMTEC SEARAY™ 400-pin female connectors P1 and P2. Following signals are present: The interface of the ADRV9009-ZU11EG consists of two SAMTEC SEARAY™ 400-pin female connectors P1 and P2. Following signals are present:
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 <WRAP round download > <WRAP round download >
 A detailed description of the connector interface for the complete system ADRV9009-ZU11EG and ADRV2CRR-FMC is located here: A detailed description of the connector interface for the complete system ADRV9009-ZU11EG and ADRV2CRR-FMC is located here:
-{{ :resources:eval:user-guides:adrv9009-zu11eg:adrv9009_zu11eg_connector_pinout.xlsx |}}+{{ :resources:eval:user-guides:adrv9009-zu11eg:adrv9009_zu11eg_connector_pinout_1.xlsx |ADRV9009-ZU11EG_Connector_Pinout}}
 </WRAP> </WRAP>
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 === Programmable Logic GPIOs === === Programmable Logic GPIOs ===
 == High Performance GPIOs == == High Performance GPIOs ==
-Programmable logic high performance banks 65, 67 and 68 are fully accessible in connector P2. Prior of using these signals the bank supply VCCO must be provided, with a voltage between 0.95V and 1.9V. A reference voltage must be applied as well, if the IO standard requires one. To use the internal VREF voltage a 500 or 1K resistor needs to be connected from VREF pin to ground.+Programmable logic high performance banks 65, 67 and 68 are fully accessible in connector P2. Prior of using these signals the bank supply VCCO must be provided, with a voltage between 0.95V and 1.9V. A reference voltage must be applied as well, if the IO standard requires one. To use the internal VREF voltage a 500 or 1KOhm resistor needs to be connected from VREF pin to ground.
 == High Density GPIOs  == == High Density GPIOs  ==
 Programmable logic High density bank 89 is partially available in connector P2. Connect a voltage between 1.14V and 3.4V to the bank supply voltage VCCO_89. Programmable logic High density bank 89 is partially available in connector P2. Connect a voltage between 1.14V and 3.4V to the bank supply voltage VCCO_89.
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 <note important>The ADRV9009-ZU11EG RF-SOM requires active cooling. It includes overtemperature protection, which interrupts power to the RF-SOM when board temperature reaches 90degC. Without a fan the RF-SOM will turn off in a few minutes under normal operating conditions (25degC ambient, Linux machine running). </note> <note important>The ADRV9009-ZU11EG RF-SOM requires active cooling. It includes overtemperature protection, which interrupts power to the RF-SOM when board temperature reaches 90degC. Without a fan the RF-SOM will turn off in a few minutes under normal operating conditions (25degC ambient, Linux machine running). </note>
  
-Included in the ADRV9009-ZU11EG RF-SOM package is a custom designed heat spreader plate, that acts as a mounting base for an active cooler. The heat spreader is designed to accommodate an active cooler with an AMD type SP3/TR4/sTRX4 socket. There are two sets of threaded holes. When thermal sheet is added between heat plate and fan the set of holes with the smaller thread depth should be used for mounting the fan. Thermal material being used is **Panasonic EYG-T7070A10A**. +The ADRV9009-ZU11EG RF-SOM comes equipped with a custom designed heat spreader plate, that acts as a mounting base for an active cooler. Panasonic EYG-T7070A10A thermal pad is used between RF-SOM and plate.
  
-The [[adi>ADRV2CRR-FMC]] kit includes a heatsink with active cooler for the ADRV9009-ZU11EG RF-SOM, and Würth Elektronik 39410 EMI gasket sheet, that acts both as thermal transfer material between heat plate and heatsink and RF Shield/Absorber.  
  
-For more information about overtemperature protection check the Power Monitoring Section on this page.+The heat spreader is designed to accommodate an active cooler with an AMD type SP3/TR4/sTRX4 socket. There are two sets of threaded holes. When thermal sheet is added between heat plate and fan the set of holes with the smaller thread depth should be used for mounting the fan.  
 + 
 + 
 +The [[adi>ADRV2CRR-FMC]] kit includes a heatsink with fan for the ADRV9009-ZU11EG RF-SOM, and Würth Elektronik 39410 EMI gasket sheet, that acts both as thermal transfer material between plate and heatsink, and RF Shield/Absorber.  
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 +==== Supplementary Testing ====
 +
 +<WRAP round download>
 +EMC testing has been carried out on the SOM. This may be useful as a reference for validation or qualification of custom designs. The report can be found here:
 +  * {{:resources:eval:user-guides:adrv9009_zu11eg:ADRV9009-ZU11EG EMC Conformance.pdf|EMC Test report}}
 +
 +</WRAP>
 +
 +----
 +
 ==== Mechanical Reference Material ==== ==== Mechanical Reference Material ====
 <WRAP round download> <WRAP round download>
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 ==== ADRV9009-ZU11EG Schematics, BOM & Errata ==== ==== ADRV9009-ZU11EG Schematics, BOM & Errata ====
-Rev C is the latest and is in mass production.+Rev C is the latest available version.
 <WRAP round download> <WRAP round download>
     * {{:resources:eval:user-guides:adrv9009_zu11eg:02-048949-01-c.pdf|Rev C Schematics}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:02-048949-01-c.pdf|Rev C Schematics}}
     * {{:resources:eval:user-guides:adrv9009_zu11eg:05-048949-01-c.zip|Rev C BOM}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:05-048949-01-c.zip|Rev C BOM}}
     * {{:resources:eval:user-guides:adrv9009_zu11eg:revb_to_revc_errata.xlsx|Rev B to Rev C Errata}}     * {{:resources:eval:user-guides:adrv9009_zu11eg:revb_to_revc_errata.xlsx|Rev B to Rev C Errata}}
 +    * {{ :resources:eval:user-guides:adrv9009-zu11eg:letter_of_volatility_adrv9009-zu11eg.pdf|Rev C Letter of Volatility}}
 </WRAP> </WRAP>
  
resources/eval/user-guides/adrv9009-zu11eg/hardware.1632124083.txt.gz · Last modified: 20 Sep 2021 09:48 by Claudia Goga

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