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resources:eval:user-guides:adrv9009-zu11eg:hardware [18 Oct 2019 14:55]
mihai.bancisor_analog.com [Hardware Reference Material]
resources:eval:user-guides:adrv9009-zu11eg:hardware [21 Oct 2019 15:51]
BrianOL Adedd new step file for Carrier and heat spreader plate
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   * {{:​resources:​eval:​user-guides:​adrv9009_zu11eg:​08_048949b_DXF.zip|Rev B DXF File}}   * {{:​resources:​eval:​user-guides:​adrv9009_zu11eg:​08_048949b_DXF.zip|Rev B DXF File}}
   * {{:​resources:​eval:​user-guides:​adrv9009_zu11eg:​08_048949b_stp.zip|Rev B STP File}}   * {{:​resources:​eval:​user-guides:​adrv9009_zu11eg:​08_048949b_stp.zip|Rev B STP File}}
 +
 +The Heat spreader plate 3D model is located here:
 +  * {{:​resources:​eval:​user-guides:​adrv9009_zu11eg:​Heatsinkv7.zip|Heat spreader 3D File}}
 +Note: Thermal material being used is Panasonic EYG-T7070A10A. The Power Control sequencer shuts down when the PCB reaches 90C.
  
 The FMC connector pinouts are located here: The FMC connector pinouts are located here:
resources/eval/user-guides/adrv9009-zu11eg/hardware.txt · Last modified: 24 Oct 2019 17:47 by BrianOL